+
+ 租户Id: |
+ {{pcbDetail.pcbBaseData.tenantId}} |
+ 订单id: |
+ {{pcbDetail.pcbBaseData.orderId}} |
+ 订单编号: |
+ {{pcbDetail.pcbBaseData.orderNo}} |
+ 板材大类: |
+ {{pcbDetail.pcbBaseData.proType}} |
+
+
+ 板材: |
+ {{pcbDetail.pcbBaseData.coreType}} |
+ 板材tg值: |
+ {{pcbDetail.pcbBaseData.coreTg}} |
+ 板材code: |
+ {{pcbDetail.pcbBaseData.coreTypeCode}} |
+ 重量: |
+ {{pcbDetail.pcbBaseData.totalWeight}} |
+
+
+ 面积: |
+ {{pcbDetail.pcbBaseData.boardArea}} |
+ 板材品牌: |
+ {{pcbDetail.pcbBaseData.boardBrand}} |
+ 是否为返单: |
+ {{pcbDetail.pcbBaseData.isReOrder}} |
+ 返单编号: |
+ {{pcbDetail.pcbBaseData.reOrderNo}} |
+
+
+ 交期类别: |
+ {{pcbDetail.pcbBaseData.deliveryType}} |
+ 交期天数: |
+ {{pcbDetail.pcbBaseData.deliveryDays}} |
+ 交期: |
+ {{formatDateTime(pcbDetail.pcbBaseData.deliveryDate)}} |
+ 生产单号: |
+ {{pcbDetail.pcbBaseData.proOrderNo}} |
+
+
+
+
+ 宽 x 高: |
+ {{pcbDetail.areaProcessData.boardWidth}} x {{pcbDetail.areaProcessData.boardHeight}} |
+ 数量: |
+ {{pcbDetail.areaProcessData.num}} |
+ pcs数: |
+ {{pcbDetail.areaProcessData.pcsNum}} |
+ set数: |
+ {{pcbDetail.areaProcessData.setNum}} |
+
+
+ 拼版类别: |
+ {{pcbDetail.areaProcessData.boardType}} |
+ 是否接受打叉板: |
+ {{pcbDetail.areaProcessData.acceptCrossed}} |
+ 拼版: |
+ {{pcbDetail.areaProcessData.pinBanX}} x {{pcbDetail.areaProcessData.pinBanY}} |
+ 拼版数: |
+ {{pcbDetail.areaProcessData.pinBanNum}} |
+
+
+ 工艺边: |
+ {{pcbDetail.areaProcessData.processEdges}} |
+ 工艺边宽: |
+ {{pcbDetail.areaProcessData.processEdgesWidth}} |
+ v割方式: |
+ {{pcbDetail.areaProcessData.vCut}} |
+ 槽间距-高x宽: |
+ {{pcbDetail.areaProcessData.grooveHeight}} x {{pcbDetail.areaProcessData.grooveWidth}} |
+
+
+ 单Set出货尺寸宽x高: |
+ {{pcbDetail.areaProcessData.deliverWidth}} x {{pcbDetail.areaProcessData.deliverHeight}} |
+
+
+
+
+ 是否需要阻焊: |
+ {{pcbDetail.personalizedProcessData.isImpedance}} |
+ 阻焊报告: |
+ {{pcbDetail.personalizedProcessData.impedanceReport}} |
+ 确认文件信息: |
+ {{pcbDetail.personalizedProcessData.productFileSure}} |
+ CAM工程师等级: |
+ {{pcbDetail.personalizedProcessData.camEngineer}} |
+
+
+ IPC标准等级: |
+ {{pcbDetail.personalizedProcessData.ipcLevel}} |
+ 出货报告: |
+ {{pcbDetail.personalizedProcessData.needReportList}} |
+ 报告材质: |
+ {{pcbDetail.personalizedProcessData.reportMaterial}} |
+ BGA数量: |
+ {{pcbDetail.personalizedProcessData.bgaNum}} |
+
+
+ BGA尺寸: |
+ {{pcbDetail.areaProcessData.bgaSize}} |
+
+
+
+
+ 板厚: |
+ {{pcbDetail.pcbStandardProcessData.boardThickness}} |
+ 板层: |
+ {{pcbDetail.pcbStandardProcessData.boardLayers}} |
+ 铜厚: |
+ {{pcbDetail.pcbStandardProcessData.copperThickness}} |
+ 内层铜厚: |
+ {{pcbDetail.pcbStandardProcessData.innerCopperThickness}} |
+
+
+ 测试方式: |
+ {{pcbDetail.pcbStandardProcessData.flyingProbe}} |
+ 最小孔径: |
+ {{pcbDetail.pcbStandardProcessData.vias}} |
+ 线宽线距: |
+ {{pcbDetail.pcbStandardProcessData.lineWeight}} |
+ 阻焊颜色: |
+ {{pcbDetail.pcbStandardProcessData.solderColor}} |
+
+
+ 底层阻焊颜色: |
+ {{pcbDetail.pcbStandardProcessData.solderColorBottom}} |
+ 字符颜色: |
+ {{pcbDetail.pcbStandardProcessData.fontColor}} |
+ 底层字符颜色: |
+ {{pcbDetail.pcbStandardProcessData.fontColorBottom}} |
+ 过孔处理: |
+ {{pcbDetail.pcbStandardProcessData.solderCover}} |
+
+
+ 线路工艺: |
+ {{pcbDetail.pcbStandardProcessData.imageTranster}} |
+ 阻焊工艺: |
+ {{pcbDetail.pcbStandardProcessData.solderTransfer}} |
+ 表面处理: |
+ {{pcbDetail.pcbStandardProcessData.surfaceFinish}} |
+ 沉金厚度: |
+ {{pcbDetail.pcbStandardProcessData.imGoldThinckness}} |
+
+
+ 电镀前工艺: |
+ {{pcbDetail.pcbStandardProcessData.beforePlating}} |
+ 板材耐压值: |
+ {{pcbDetail.pcbStandardProcessData.withstandVoltage}} |
+ 成型方式: |
+ {{pcbDetail.pcbStandardProcessData.formingType}} |
+ 耐压测试: |
+ {{pcbDetail.pcbStandardProcessData.wvTest}} |
+
+
+